Mechatromation

FA

Mechanics
& Electronics

Electrical Distribution
& Control

Laser Patterning

Flat panel display market

　The growth industries of flat panel television, PC, Cellular phone and car-navigation system occurs rapid expansion of flat panel display market.  In particular, the rapid expansion of a LCD, PDP, OEL and etc. is expected in much demand for flat panel television to replace with cathode-ray tube television.  However, as Flat Panel Display market grows, suppliers of display are always trying to produce the low price panel and reduce the production costs.

The thin film circuit used for a flat panel display

 Since 2002, we had researched for new technology to give a reduction of the production costs in manufacturing system.  We observed the thin films of various functional materials.  Flat Panel Display consists of thin film formed glass substrates.  In the production of Flat Panel Display, it is necessary to pattern on thin film in order to make a micro-electric circuit on a glass substrate.   The ordinary process of forming thin film pattern is the method using photo-lithography and etching as shown in Fig.1.

Fig. 1 Conventional thin film pattern formation method 
(Photo lithography and etching processing)

• 1^st.step   The thin film on glass substrate is covered with photoresist.

• 2^nd.step   The photoresist is exposed to a micro-electric circuit pattern of Ultraviolet light. The photoresist becomes chemically more stable when exposed.

• 3^rd.step  The photoresist is removed by a solution called "developer" without areas that are exposed by Ultraviolet light.  

• 4^th.step  The liquid chemical agent removes the thin film on the glass substrate in the areas that are not protected by photoresist. 

• 5^th.step  The unnecessary photoresist on the substrate is removed from the thin film. 

• 6^th.step  The substrate is washed to remove the contamination made before step.

Then, this process is complete and the thin film pattern on glass is given.   
This process is used in many factories. However, it is necessary to install many equipments and spend heavy costs on manufacturing.

Development of the new process technology by Laser

 We had developed the new technology that the thin films are removed by scanning laser and we were able to form the various patterns of thin film on the glass.  This technology can give a simple process of manufacturing, an allowance the investment and a reduction the expense of electric power and chemical material.  This laser patterning process is one of the earth conscious methods, because it is not necessary to dispose of used chemical materials.  We are studying about the laser processing for the various thin films materials and researching the method of choice the laser and the optics for the various applications.  And then, for having a good knowledge to produce the manufacturing system, we are developing the technology of electronic control, mechanics and Vacuum the contamination.

In 2005,we produced the laser patterning machine for thin film (Proto type) with Osaka University and Kyushu University in the project of Ministry of economy, trade and industry. This thin film pattern processing machine has the double wavelength DPSS laser, the multi beam heads for scanning and the accurate positioning stage system for substrate of max size 1000mmX1000mm etc.

For the clean energy

Now, photovoltaic power generation market is growing larger than any other industries, because reduction of CO2 is necessary and the price of Oil is very high.  So the thin film solar is unnecessary much Si and low in price, the Demand of thin film solar cell is increasing rapidly in EU and other countries.  And many production plant of thin film solar cell are building rapidly. Our laser patterning technology is match with the thin film solar cell production, and then, we are supplying for this application now.

Thin film Laser Patterning Machine
Proto Type

Dual wave processing can be done at one time (Classified by each processing point)

		[Compatibility of processing handling] Improvement of processing capacity by "IR beam 4heads and UV beams 8 heads" Random beam positioning by work set plate XYθ A-axis drive and beam head drive. [Machine down sizing] Extension of processing margin by length processing point depth. Work size Max 1000mmX1000mm
Basic Specification
Laser Oscillator	DPSS Laser (Diode pumped Nd:YVO4 Laser and Diode pumped Fiber Laser)
Wavelength	Diode pumped Nd:YVO4 Laser - 1054nm,532nm,355nm,266nm Diode pumped Fiber Laser - 1060nm
processing speed	X axis -max 1000mm/s (Linear drive). Y axis - max 500mm/s (Linear drive). θ axis  -45°/s (Direct drive motor)
Precision of processing table	<±30μm
The status of processing by thin film Laser patterning machine
ITO thin film processing glass substrate  [Width of processing line - 10μm]		Cr thin film processing on glass substrate  [Width of processing line - 80μm]
ITO thin film patterning   glass substrate  [Width of processing line - 30μm Line pitch 250μm]		Al thin film patterning on glass substrate  [Width of processing line - 60μm Line pitch 250μm]