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| 1936 | May | ●Founded in Higashi-machi, Kurume City as a motor repair shop | |||||
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| 1963 | Aug. |
●Takei Electric Production (unlimited partnership) founded ●Design and production of control and operation boards for machine tools |
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| 1966 | Sep. |
●Reorganized as Takei Electric Co., Ltd. (capital ￥2,000,000) ●Design and manufacture of control boards with SCR |
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| 1967 | Apr. | ●Capital increased to￥4,000,000 | |||||
| 1970 | Sep. |
●Capital increased to ￥6,000,000 ●Design and manufacture of control boards with non-arcing relay ●Started receiving orders on electrical equipment from manufacturing and water treatment plants |
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| 1971 | Apr. | ●Design and manufacture of analog controller with IC and LSI | |||||
| 1973 | Apr. | ●Capital increased to ￥12,000,000 | |||||
| 1973 | Sep. |
●Plant moved to Miyaki-machi, Miyaki-gun, Saga ●Capital increased to ￥24,000,000 ●Started manufacture of SCR (stationery) Leonard System or new paper mills and steel mills |
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| 1974 | Mar. |
●Main office moved to 2-1-11, Edoyashiki, Kurume ●Design and manufacture of digital equipment using IC, LSI and MOS-IC |
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| 1975 | Jan. | ●Established electric work section | |||||
| 1977 | Apr. | ●Introduced debugging machine produced by INTEL | |||||
| 1977 | Oct. | ●Capital increased to ￥36,000,000 | |||||
| 1978 | Oct | ●Established Mechanical Division | |||||
| 1978 | Dec. |
●Design and manufacture of control device of Electro-spark machinery equipment with microcomputer at power source ●Design and manufacture of interface and control equipment for retrofit (up-grade) in the machine tool division of Fuji FANAC NC |
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| 1982 | Sep. | ●Finished trial production of industrial robotics | |||||
| 1983 | Mar. | ●Capital increased to ￥48,000,000 | |||||
| 1986 | Mar. | ●Established FA System Division (former Machinery Division) | |||||
| 1992 | Apr. | ●Manufactured production facility for disks for light optical recording media | |||||
| 1994 | Jan. | ●Capital increased to ￥78,000,000 | |||||
| 1995 | Apr. | ●Developed and sold robots for carrying cardboard | |||||
| 1996 | Oct. | ●R&D high-speed wire bonding, final process in the production of semiconductors | |||||
| 1998 | Feb. |
●Completed and tested a trial high-speed wire bonder ●R&D special Die Bonder |
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| 1998 | Apr. | ●R&D cleaning device, first process in the production of semiconductors | |||||
| 1998 | Dec. |
●R&D Wafer resistance-saving spin coating ●Capital increased to ￥98,300,000 |
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| 1999 | May | ●Obtained ISO9001 | |||||
| 2000 | Sep. | ●Capital increased to ￥137,450,000 (schedule) | |||||
| 2003 | December | ●The laser processing equipment of a ITO transparent electrode developed (ProtoType). | |||||
| 2004 | August | ●Kurume factory establishment to Tsubukuhommachi, Kurume-city | |||||
| 2005 | August | ●The subsidy of the Ministry of Economy, Trade and Industry is received to development of laser processing equipment. | |||||
| 2006 |
Jun |
●Obtained ISO14001 | |||||
| 2008 | Jun | ●The head office is put on Miyaki-cho, Miyaki-gun, Saga-ken Eguchi 2617. | |||||
