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High-Power Fiber Laser Unit
High-Power Fiber Laser Unit
What is the High-Power Fiber Laser Unit?
This is a full-scale processing unit that has been developed for easy use of absolute processing capacity with high output 100W in metal processing. The laser oscillator, digital Galvano scanner, and control are compactly integrated, and even beginners can reproduce the position of 1 μm or less, and can switch the repetition frequency from 50 to 1000 kHz and the pulse width of 20/30/60 / 120 nsec.
Synchronous control with encoder signals enables machining in transit.
You can enjoy full-scale fiber laser more easily than ever before.
Cut copper foil (thickness 50 μm) using a fiber laser unit [TLFD-100]
Digital Galvano scanner enables the position reproducibility of 1 μm or less, with minimal heat affected zone (HAZ).
Cut stainless steel foil (thickness 50 mm) using a fiber laser unit [TLFD-100]
Digital Galvano scanner enables the position reproducibility of 1 μm or less, with minimal heat affected zone (HAZ).
Features of Fiber Laser Unit
Beautiful Finish with low HAZ
Pulse width is switchable in 20/30/60/120 seconds according to the processing purpose.
Pulse width is switchable in 20/40/60/120nsec.
Repeated frequency is switchable from 20 to 1000kHz.
The short pulse setting results in high peak output oscillation, enabling machining with low heat effect.
Shortened Processing Time, Deeper
Stunning cutting capability at high output
Doubled Laser Output Power
Because the laser output is 100W, which is about twice the output of a general-purpose laser marker, the processing time can be shortened and productivity is improved."
Highest Level of Machining Position Accuracy
Position reproducibility of 1μm or less by a digital encoder.
Position accuracy is 10 times accurate
Laser scanning with a digital Galvano scanner achieves even higher position accuracy than laser markers.
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Applications
Cutting of Copper Foil (50μm in thickness)
Cutting of Stainless Foil (50μm in thickness)
Cutting of Aluminum Foil
Ceramic Processing
Hairpin Enamel Peeling
Circuit Formation
Metal Leaf precision Drilling
Trimming the Film on the Copper Surface
Materials to be processed
Metal Sheet/Metal Leaf
- Iron
- Stainless
- Aluminum
- Steel
Brittle Materials
- Ceramic Substrate
- Silicon Substrate
- GaN Substrate
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Use Applications
5G
- Stripping of wire coating
Mobile/Touch Panel
- Printing/marking on parts
Battery
- Laser Cutting of electrode metal leaf
Electronic Components
- Printing/marking on parts
Automobile
- Motor hairpin coating removal
TLFD-100 Leaflet
A new model that makes laser processing more familiar
TLFD-100
This is a laser processing unit that can perform various processing with an easy-to-use style like a laser marker.
The combination of a high-power fiber laser of 100 W or more and a digital Galvano scanner realizes high-precision and full-scale machining.
We also offer a number of optics options to accommodate a variety of applications.
| Specifications | Model | TLFD-100 |
|---|---|---|
| Laser | Laser Type | Fiber Laser |
| Average Output Power | 100(w) | |
| Maximum Pulse Energy | 1.0(mJ) | |
| Wavelength | 1064(nm) | |
| Pulse Width | 20/30/60/120 (nsec) variable | |
| Repetition Frequency Range | Pulse width 20 or 30 nsec at 50 - 1000 (kHz) | |
| Galvano Scanner | Repeated Position Accuracy | ±1μm at scan area of 100 × 100nm |
| Beam Scanning Speed | Max. 3000/sec or higher | |
| Focal Range/Drive stage | Customizable | |
| General Spec. | ||
| Input Voltage | Single phase AC100~240V 50/60Hz | |
| Power Consumption(during processing) | 700VA | |
| Maximum Pulse Energy | 1.0(mJ) | |
| Environment Resistance | Ambient Temperature in use | 15～30℃ |
| Ambient Humidity in use | 70%RH or less, non condensing | |
| Main Equipment Weight | 18kg (head) | |
| Ancillary Equipment | Control box, integrated PC | |
| Installation Condition | Indoors free of dust, toxic gas, water droplets, oil, electromagnetic waves, and vibration | |