The demand for microfabrication in the electronics field is increasing year by year, and in order to meet the needs of future product development, we have a comprehensive product lineup including evaluation equipment for CO2 lasers, nanosecond fiber lasers, and ultrashort pulse lasers to broadly meet our customers' requirements.

We develop and manufacture in-house laser processing equipment for applications such as high-speed film cutting and precision drilling, ceramic scribing, and precision circuit formation.
We have earned a top-class reputation in Japan for fields that require high machining positional accuracy and micro-machining.
Our CO2 laser processing equipment has a proven track record in a wide range of applications, including film cutting, half-cutting (cutting only selected films within laminated films), cutting only laminated films without damaging glass, micro-perforation, and decorative processing. As an example of our technology, our synchronous control know-how, which enables high-speed cutting of complex shapes while maintaining high quality, is widely used not only for films but also for ceramic processing, dramatically improving productivity in mass production processes.
Our solid-state laser processing equipment allows us to select the most suitable laser and set processing conditions according to your application, such as patterning, micro-hole drilling, and marking of thin-film micro-circuits. Furthermore, laser processing equipment equipped with ultrashort pulse lasers is supplied to fields with even finer precision and higher quality requirements, contributing to the future product development in fields such as electronics and semiconductors.
Our laboratory is equipped with various evaluation equipment, including CO2 lasers, nanosecond fiber lasers, and picosecond lasers, to meet a wide range of your needs.
Depending on your requirements, we offer a range of laser processing equipment, from unit-type machines to machines with drive tables and mass production systems that can be used for automatic transfers.
This special technology, which achieves both high-speed processing several times faster than conventional laser processing and high-quality cut surfaces, solves the challenges of reducing processing time, the number of machines required, installation space, and manpower.
The evaluation and verification device, equipped with laser oscillators for both the fundamental and UV wavelengths of ultrashort pulse lasers, can perform ultra-fine drilling, cutting, and scribing processes on workpieces up to a maximum size of 700mm square for processing evaluation.
We also handle many custom designs and manufacturing projects for laser processing equipment equipped with your desired laser oscillator.
As a manufacturer of factory automation (FA) equipment, our company has a wealth of expertise in equipment development cultivated over many years.
Here's a brief introduction to the various products created using our laser processing equipment.







The demand for microfabrication in the electronics field is increasing year by year, and in order to meet the needs of future product development, we have a comprehensive product lineup including evaluation equipment for CO2 lasers, nanosecond fiber lasers, and ultrashort pulse lasers to broadly meet our customers' requirements.
・We also offer sample processing tests before you purchase a laser processing machine.
・We do not offer contract machining services for parts only, but we can introduce you to a suitable contractor depending on the nature of your request.









We also offer laser processing tests before you purchase the equipment. If you require this service, please contact us via the inquiry form.
(We do not offer contract machining services for parts only, but depending on the nature of your request, we can introduce you to a suitable partner.)
Select the optimal laser processing conditions.
Customization options available depending on the product and mass production requirements.

We also procure specialized optical components and precision parts.
High precision achieved through superior precision assembly technology.
Fine-tuning to the optimal laser processing conditions and operation.
We check the processing quality, various functions, and safety.
We will set up the equipment at your factory and explain how to operate it.
We also provide after-sales service after delivery.

実施機関:経済産業省 戦略的基盤技術高度化支援事業
対象期間:平成26.27年度
実施機関:NEDO(新エネルギー・産業技術総合開発機構)
イノベーション実用化ベンチャー支援事業
対象期間:平成25年度
実施機関:中小企業庁
ものづくり中小企業・小規模事業者試作開発等支援事業
対象期間:平成25年度
実施機関:経済産業省 中小企業・経営革新支援補助金
対象期間:平成17年度
登録日:平成25年7月12日
レーザー加工装置
レーザー加工装置におけるキャリブレーション方法及びキャリブレーションプログラム
登録日:平成25年3月1日
薄膜積層ガラス基板の薄膜除去方法及び装置
登録日:平成24年8月17日
レーザー加工用集塵装置
登録日:平成23年12月16日
薄膜除去方法及び薄膜除去装置