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Ultrashort Pulse Laser Processing Machine
Ultrashort Pulse Laser Processing Machine is a device that can perform precision processing while minimizing thermal effects with pulse widths measured in picoseconds.High-power fiber lasers and digital encoder control enable micron-level positional repeatability, meeting a wide range of processing needs such as micro-cutting, drilling, and marking of various materials.It can be used from research and development to mass production.
- Minimizing heat damage to the greatest extent possible
- Extremely precise micro-machining is possible.
- High positional accuracy
- Compatible with a wide range of materials including resins and metals.
What is ultrashort pulse laser processing
Ultrashort pulse laser processing is an ultra-precise processing method that minimizes thermal damage by irradiating materials such as ceramics, metal foils, glass, and resins with laser light in extremely short pulse durations ranging from picoseconds to femtoseconds.
In addition to its absolute processing capability with a high output of 100W, its position repeatability of less than 1 μm thanks to the digital encoder makes it suitable for use from research and development to mass production lines.
Ultrashort Pulse Laser Processing Machine【TLFD-100P】
IR wavelength 100W picosecond laser
Processing examples
Ceramics cutting and surface processing
Thickness 0.7mm
Ceramics Scribing
Thickness 0.7mm
Glass cutting and surface processing
Thickness: 0.8mm
Ceramics Al2O3
t=0.8mm cutting
Glass Na2O-CaO-SiO2
t=1.1mm cutting
Micro-hole drilling of ceramics t=0.04mm
Drilling（Φ10～20μm 0.2mm pitch）
Laser processing machine for evaluation testing
UV wavelength 50W picosecond laser
Processing examples
Target materials
Brittle materials
- ceramic substrate
- Silicon substrate
- SiC substrate
- GaN substrate
- Glass substrate
Metallic sheets metal foil
- iron
- copper
- stainless
- aluminum
- steel
Resin-based film
- PI(Polyimide)
- PET(Polyethylene terephthalate)
- PP(polypropylene)
- PE(polyethylene)
- COP(Cyclic olefin polymers)
- TAC(Triacetylcellulose)
- PMMA(acrylic)
Industry
Semiconductors/LEDs
- Film cutting・Micro-hole drilling
- Scribing ceramic parts・Cutting・Micro-hole drilling
High-performance film
- Micro-perforation of laminated films
Mobile・Touch panel
- Film cutting・Micro-hole drilling
- Scribing ceramic parts・Cutting・Micro-hole drilling
Display
- Cutting of laminated film・Micro-hole drilling
- Scribing ceramic parts・Cutting・Micro-hole drilling
In-vehicle
- Cutting display film・Micro-hole drilling
- Scribing ceramic parts・Cutting・Micro-hole drilling
Food packaging
- Micro-perforation of packaging film
Pharmaceuticals
- Cutting medical film・Micro-hole drilling
- Scribing ceramic parts・Cutting・Micro-hole drilling
Leaflet・Catalog
Laser processing device equipped with a picosecond laser oscillator
High-precision drive stage・Image alignment・Equipped with a digital galvanometer scanner
TLSM-series
High-precision drive stage, galvanometer scanner, and image alignment enable high-quality, high-speed micro-cutting at any desired position・Drilling・It enables inner marking.
You can easily import drawing data and make program changes or switch between small-batch versions.
| Model | TLSM-series |
|---|---|
| Oscillator/Rated Power (Wavelength) | IR picosecond laser 100W / UV picosecond laser 30W (Choose one) |
| Laser Scanning Method | Galvanometer scanner scanning, XY axis movement by machining stage |
| Galvano Scanner | Digital Galvano scanner |
| Stage | Linear drive XY stage (Max.1000mm/s) |
| Position Alignment | Aligned with image recognition |
| Supported work size | Max500×500mm (vacuum suction on aluminum table) (The evaluation prototype can accommodate dimensions up to 700mm square) For sizes larger than □ 500mm, please inquire about optional services. |
| Machine Dimension | W2100mm×D2100×H2100mm |